Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Artificial intelligence (AI) is no longer a research concept — it is the economic engine driving infrastructure investment worldwide. The growth of AI data centers, powered by high-performance CPUs, ...

ABS and Siemens Energy have signed a joint development project (JDP) agreement to advance the understanding of thermal ...

Fabric might be the last thing on your mind when firefighters rescue someone from a burning building, but without fire-resistant clothing, such rescues might not happen at all. The turnout gear that ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

Discover how heat resistant materials and material science innovations help electronics manufacturing manage rising temperatures, boost reliability, and enable smaller, more powerful next‑generation ...

Thermal management has long been a key challenge facing design engineers. For decades, engineers have faced trying to dissipate heat from densely packed electronics that have continued to shrink in ...

The Xe-100 is a 200MWt Advanced Pebble Bed Reactor that will be deployed in Washington State in the 2028 timeframe with the support of the US DOE Advanced Reactor Demonstration Program. The Xe-100 has ...

Thermal behavior at the component, board and system level is becoming increasingly important in electronics design. While systems are becoming more energy efficient, there is still the requirement to ...

In a nutshell: For more than half a century, the relentless progress of Moore's Law has driven engineers to double the number of transistors on a chip approximately every two years, fueling ...