Finnish company Semiqon has developed a transistor that operates with virtually zero heat dissipation. They have made silicon-based quantum processors to make future quantum computers more affordable, ...

Low power design has become a cornerstone of modern integrated circuit development, driven by energy efficiency demands and the challenges of scaling in nanometre technologies. Innovations in ...

As transistors are scaled to smaller dimensions, their static power increases. Combining two-dimensional (2D) channel materials with complementary metal–oxide–semiconductor (CMOS) logic architectures ...

The latest Spice transistor models contain provisions for modeling the complex junction characteristics. They can even extend the simulations to include RF performance. In many ways, the CMOS ...

The International Electron Devices Meeting (IEDM) held Dec. 2-6, 2017, in San Francisco offered imec and Leti an opportunity to disclose several innovations. imec announced three new developments: ...

Toshiba explained that by applying this technique, gate density for 45-nm CMOS technology is boosted to 2.6 times higher than that of 65-nm CMOS technology, and surpasses the typical gain of 2 times ...

Intel's upcoming RibbonFET technology is set to debut in the company's 20A node next year, but already the chip maker is showcasing the next step: 3D stacked CMOS (complementary metal oxide ...

make use of 300-mm wafers. "Our ongoing research allows us to stay on the forefront of transistor design, which translates into increasingly powerful processors. Transistor technology is the 'engine' ...

SAN JOSE, Calif. — Seeking to propel new designs and product cycle times, Fujitsu Ltd.'s chip unit has introduced a new process design kit (PDK) for its 90- and 65-nm radio-frequency (RF) CMOS ...

Not so long ago, a computer filled a whole room and radio receivers were as big as washing machines. In recent decades, electronic devices have shrunk considerably in size and this trend is expected ...