Ministry of Testing is where software testing and quality engineering professionals grow their careers. Reach new heights ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

With every process node advance, new types of manufacturing defects manifest. These defects are especially prevalent during the early phase. For early adopters, silicon manufacturing tests must evolve ...

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

Physical defects like shorts and opens may occur during any step of the fabrication process. Well-known fault models like stuck-at (SA), 1 transition (TR), 2 N-detect (ND), 3 gate-exhaustive (GE), 4 ...