Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced ...

As a leading supplier of automotive semiconductors, STMicroelectronics must continue to move fast to develop and deliver leading-edge solutions. Employing package design as part of system innovation ...

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

That’s where IC packaging comes in. It’s like the housing for your phone or the case for your computer – it does a lot more ...

Modern ICs involve more than monolithic silicon; they blend multiple chips from different silicon process technologies mounted on varying substrates and housed in a variety of package types.