Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory ...
Advanced BCD technologies use deep trench isolation (DTI) to optimize area and to suppress parasitic effects in bi-polar junction transistors (BJTs). However, DTI increases thermal resistance and self ...
Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...
Discovering a design error after you send youraverage chip to manufacturing can be costlyand embarrassing, not to mention hazardous toyour career. However, as Intel ...
CARY, NC--(Marketwire - Nov 7, 2012) - Coventor®, Inc., the leading supplier of design automation software for developing micro-electromechanical systems (MEMS), today introduced the MEMS+ ® 3.0 ...
GUC engineers are using Ansys HFSS 3D Layout’s advanced simulation workflow to speed advanced integrated circuit (Advanced-IC) design The workflow helps GUC rapidly incorporate its die-to-die solution ...
Solido™ Simulation Suite, (“Solido Sim” software) featuring AI-accelerated SPICE and FastSPICE engines, represents a significant leap forward in analog/mixed signal IC simulation technology, providing ...
June 24, 2024 -- Plano, Texas, USA -- Siemens Digital Industries Software today introduced Solido™ Simulation Suite software(“Solido Sim” software), an integrated suite of AI-accelerated SPICE, Fast ...
China-based EDA leader Empyrean Technology and Shanghai UniVista Industrial Software Group have jointly announced their collaboration to build a digital-analog mixed design and simulation EDA solution ...
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