METZ CONNECT has developed a spring clamp terminal block with compression-mount contacts that is ideally suited for compact, low profile devices for building automation applications. In the race to ...
The company's micro BGA and CSP test and burn-in sockets can accept devices measuring 13 x 13 mm with a pitch of 0.5 mm or larger in applications operating up to 1 GHz. Both sockets employ solderless, ...
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