March 17, 2011 (New York, NY) Top international design and architecture firm Perkins Eastman is pleased to join The Green House project and NCB Capital Impact in announcing the launch of The Green ...

As a leading supplier of automotive semiconductors, STMicroelectronics must continue to move fast to develop and deliver leading-edge solutions. Employing package design as part of system innovation ...

A Protection and Control (P&C) design package for a typical substation includes a number of interrelated drawings, including one-line diagrams, schematic diagrams, wiring diagrams and interconnection ...

In this Q&A, you will learn about some of the technologies and techniques that are making it possible to address advanced ...

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

Today’s heterogeneously integrated semiconductor packages represent a breakthrough technology that enables dramatic increases in bandwidth and performance with reduced power and cost compared to what ...

Modern ICs involve more than monolithic silicon; they blend multiple chips from different silicon process technologies mounted on varying substrates and housed in a variety of package types.

Power electronics that convert one voltage level to another are at the heart of many aspects of electric cars. To extend the driving range of electric cars, companies are trying to design smaller, ...