Infineon Technologies AG and Lenovo are intensifying their collaboration to accelerate the next level of autonomous driving.

e-con Systems launches its first Edge AI Vision Box—Darsi Pro built on the NVIDIA Jetson platform at CES 2026. The showcase ...

ANRITSU CORPORATION announces that its test solution for the latest USB4 Version 2.0 (USB4 v2) communication standard ...

Renesas Electronics Corporation a supplier of semiconductor solutions, is expanding its software-defined vehicle (SDV) ...

The PF-SRC50E series is engineered to meet the requirements of UL 248-13 and IEC 60269-4 (aR class) standards.

Quantum Saxony' is being launched to pool, develop, and make the expertise in quantum technologies within the Free State of ...

Siemens has introduced Siemens’ electronic design automation software to enhance its power devices and analogue semiconductor ...

The US has paused implementation of its technology agreement with the UK, citing frustration over stalled broader trade ...

KIC announced that its global headquarters will relocate to a new, expanded facility in San Diego to expand operations & ...

Hirose has launched a 1.0mm coaxial connector that complies with the IEEE Std 287 and supports frequencies up to 110GHz.

SECO announces the immediate availability of its Modular Vision 10.1 ASL. Part of the company’s next-generation Modular ...

Singular Photonics and Renishaw co-develop next-gen spectroscopy capabilities powered by Singular’s new suite of SPAD image ...