For fabrication, a 3D STEP file would be more useful than a 2D centerline sketch. Export as STEP AP214, and you can include ...
Interface IP in 3D; SOCAMM in data centers; edge intelligence implementations; deposition, etch for 3D; interconnect ...
The boundaries between IP reuse, interconnect design, and hardware-software integration are no longer independent.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results